Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices /
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| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
Davis, Calif:
University of California,
1993.
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| Subjects: | |
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| LEADER | 00923nam a2200205 a 4500 | ||
|---|---|---|---|
| 008 | 981208s1993 xxua 00 eng d | ||
| 040 | |a UKM | ||
| 090 | |a TK7871.85 |b .M84 4 | ||
| 100 | 0 | |a Mohd. Salleh Ismail. | |
| 245 | 1 | 0 | |a Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices / |c by Mohd Salleh Ismail. |
| 260 | |a Davis, Calif: |b University of California, |c 1993. | ||
| 300 | |a 155 p. : |b ill. ; |c 30 cm. | ||
| 502 | |a Thesis (Doctor of Philosophy) - University of California, 1993. | ||
| 650 | 0 | |a Semiconductor wafers. | |
| 650 | 0 | |a Integrated circuits |x Water |x scale integration. | |
| 907 | |a .b12307130 |b 16-01-24 |c 12-11-19 | ||
| 998 | |a t |b 08-05-99 |c m |d x |e - |f eng |g xxu |h 0 | ||
| 914 | |a vtls000238002 | ||
| 991 | |a Fakulti Kejuruteraan dan Alam Bina | ||
| 945 | |a TK7871.85.M84 4 |g 1 |i 00000843947 |j 0 |l t0040 |n No. of pieces: 1 |o - |p MYR0.00 |q - |r - |s - |t 3 |u 0 |v 0 |w 0 |x 0 |y .i15463898 |z 12-11-19 | ||