A study of wire bonded Cu-A1 in microelectronics packaging /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
Bangi :
Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia,
2002
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| Subjects: | |
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| Physical Description: | xiv, 123 p. : ill. ; 30 cm. |
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| Bibliography: | References : p. 105-119 |