A study of wire bonded Cu-A1 in microelectronics packaging /
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| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
Bangi :
Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia,
2002
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| Subjects: | |
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| LEADER | 01127nam a2200253 a 4500 | ||
|---|---|---|---|
| 008 | 031223s2002 my a m 000 0 eng | ||
| 039 | 9 | |a 200404221206 |b bakar |c 200404151406 |d diana |c 200403301108 |d norehan |y 12-23-2003 |z norehan | |
| 090 | |a TK7874.T36 2002 tesis | ||
| 100 | 1 | |a Tan, Chee Wei | |
| 245 | 1 | 2 | |a A study of wire bonded Cu-A1 in microelectronics packaging / |c Tan Chee Wei |
| 260 | |a Bangi : |b Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, |c 2002 | ||
| 300 | |a xiv, 123 p. : |b ill. ; |c 30 cm. | ||
| 502 | |a Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002 | ||
| 504 | |a References : p. 105-119 | ||
| 610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations |
| 650 | 0 | |a Microelectronic packaging | |
| 650 | 0 | |a Microeclectronic packaging |x Technological innovations | |
| 907 | |a .b13308002 |b 28-09-20 |c 12-11-19 | ||
| 998 | |a t |b 12-10-03 |c m |d x |e - |f eng |g my |h 2 | ||
| 914 | |a vtls000345595 | ||
| 990 | |a nmk | ||
| 990 | |a Sbs/ndr | ||
| 991 | |a Koleksi Arkib | ||
| 945 | |a TK7874.T36 2002 tesis (00008052077) |g 0 |i 00001341700 |j 0 |l t0040 |n No. of pieces: 1 |o - |p MYR0.00 |q - |r - |s - |t 3 |u 0 |v 0 |w 0 |x 0 |y .i1739904x |z 12-11-19 | ||