Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan /
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| 主要作者: | |
|---|---|
| 格式: | Thesis 图书 |
| 语言: | Malay |
| 出版: |
Bangi :
Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia,
2006
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| 090 | |a TK7871.85 |b . H648 2006 3 | ||
| 100 | 1 | |a Hoh, Huey Jiun | |
| 245 | 1 | 0 | |a Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan / |c Hoh Huey Jiun |
| 260 | |a Bangi : |b Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, |c 2006 | ||
| 300 | |a xvi, 122 p. : |b ill. ; |c 30 cm. | ||
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| 504 | |a Rujukan : p. 114 - 122 | ||
| 610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations |
| 650 | 0 | |a Dissertations, Academic |z Malaysia | |
| 650 | 0 | |a Semiconductor wafers |x Design and construction | |
| 650 | 0 | |a Semiconductor | |
| 650 | 0 | |a Integrated circuits | |
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