Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /
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Format: | Thesis Book |
Language: | Malay |
Published: |
Bangi :
Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia,
2007
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LEADER | 01253nam a2200313 a 4500 | ||
---|---|---|---|
003 | UKM | ||
005 | 20080707144700.0 | ||
008 | 080604s2007 my da m 000 0 may | ||
039 | 9 | |a 200807071447 |b laili |c 200806051228 |d norehan |y 06-04-2008 |z shahrur | |
040 | |a UKM | ||
090 | |a TK7836.I277 2007 tesis 3 | ||
090 | |a TK7836 |b .I277 2007 3 | ||
100 | 0 | |a Ibrahim Ahmad | |
245 | 1 | 0 | |a Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) / |c Ibrahim Bin Ahmad |
260 | |a Bangi : |b Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, |c 2007 | ||
300 | |a xviii, 163 p. : |b ill. ; |c 30 cm. | ||
502 | |a Tesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2007 | ||
504 | |a Rujukan : p. [149] - 159 | ||
610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations |
650 | 0 | |a Dissertations, Academic |z Malaysia | |
650 | 0 | |a Lead free electronics manufacturing processes | |
650 | 0 | |a Solder and soldering | |
650 | 0 | |a Alloys | |
907 | |a .b14206936 |b 28-05-21 |c 12-11-19 | ||
998 | |a l0013 |b 06-04-08 |c m |d x |e - |f may |g my |h 0 | ||
914 | |a vtls003378616 | ||
990 | |a NY/nms | ||
991 | |a Fakulti Kejuruteraan | ||
945 | |g 1 |i 00001345234 |j 0 |l l0013 |n No. of pieces: 1 |o - |p MYR0.00 |q - |r - |s - |t 3 |u 0 |v 0 |w 0 |x 0 |y .i18760831 |z 12-11-19 |