Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /

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Bibliographic Details
Main Author:	Ibrahim Ahmad
Format:	Thesis Book
Language:	Malay
Published:	Bangi : Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, 2007
Subjects:	Universiti Kebangsaan Malaysia > Dissertations Dissertations, Academic > Malaysia Lead free electronics manufacturing processes Solder and soldering Alloys
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