Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | Malay |
| Published: |
2008
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| Subjects: | |
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| 100 | 0 | |a Muhammad Najib Harif | |
| 245 | 1 | 0 | |a Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor / |c Muhammad Najib bin Harif |
| 260 | |a 2008 | ||
| 300 | |a xii, 117 p. : |b charts, ill. ; |c 30 cm. | ||
| 502 | |a Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2008 | ||
| 504 | |a Rujukan : p. 80-86 | ||
| 610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations |
| 650 | 0 | |a Dissertations, Academic |z Malaysia | |
| 650 | 0 | |a Solder and soldering | |
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