Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
Saved in:
Main Author: | Mohamad Firdaus Rosle |
---|---|
Format: | Thesis Book |
Language: | Malay |
Published: |
2010
|
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
by: Saidatul Azura Radzi
Published: (2011) -
First bonding parameter optimization in wire bonding process /
by: Syila Izawana Ismail -
Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /
by: Mohd Firdaus Manap
Published: (2017) -
The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
by: Ghazali Omar
Published: (2005) -
Optimization and reliability of wirebond looping profile for broken neck failure /
by: Teoh, Cheng Lock
Published: (2012)