Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | Malay |
| Published: |
2012.
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| Subjects: | |
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| LEADER | 01229nam a2200313 a 4500 | ||
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| 003 | UKM | ||
| 005 | 20131126092800.0 | ||
| 008 | 131018s2012 my dal m 000 0 may d | ||
| 039 | 9 | |a 201311260928 |b baizura |y 10-18-2013 |z zarina | |
| 040 | |a UKM | ||
| 090 | |a TK7870.16.Z337 2012 tesis | ||
| 090 | |a TK7870.16 |b .Z337 2012 | ||
| 100 | 0 | |a Zainudin Kornain. | |
| 245 | 1 | 0 | |a Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) / |c Zainudin bin Kornain. |
| 260 | |c 2012. | ||
| 300 | |a xix, 200 p. : |b charts, samples, ill. ; |c 30 cm. | ||
| 502 | |a Tesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2012. | ||
| 504 | |a Rujukan : p. [179]-197. | ||
| 610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations. |
| 650 | 0 | |a Dissertations, Academic |z Malaysia. | |
| 650 | 0 | |a Flip chip technology. | |
| 650 | 0 | |a Electronic packaging. | |
| 650 | 0 | |a Ball grid array technology. | |
| 907 | |a .b15751004 |b 28-09-20 |c 12-11-19 | ||
| 998 | |a t |b 10-05-13 |c m |d x |e - |f may |g my |h 0 | ||
| 914 | |a vtls003542587 | ||
| 990 | |a szj/nm | ||
| 991 | |a Pusat Pengajian Siswazah. | ||
| 945 | |a TK7870.16.Z337 2012 [00008051985] |g 1 |i 00002100774 |j 0 |l t0040 |n No. of pieces: 1 |o - |p MYR0.00 |q - |r - |s - |t 3 |u 0 |v 0 |w 0 |x 0 |y .i20412150 |z 12-11-19 | ||