Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /
Saved in:
Main Author: | Zainudin Kornain |
---|---|
Format: | Thesis Book |
Language: | Malay |
Published: |
2012.
|
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Improvement on the ball attach process of BGA packages /
by: Thiaga Rajan Muthusamy
Published: (1999) -
Temperature cycling test for a Ball Grid Array (BGA) package using finite element analysis (FEA)
by: Muhammad Nubli, Zulkifli -
Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /
by: Muhammad Najib Harif -
Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
by: Muhammad Nubli, Zulkifli -
Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /
by: Ibrahim Ahmad
Published: (2007)