Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /

Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /

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书目详细资料
主要作者:	Zainudin Kornain
格式:	Thesis 图书
语言:	Malay
出版:	2012.
主题:	Universiti Kebangsaan Malaysia > Dissertations. Dissertations, Academic > Malaysia. Flip chip technology. Electronic packaging. Ball grid array technology.
标签:	添加标签没有标签, 成为第一个标记此记录!

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