Elektropengendapan aloi nanostruktur Co-Ni-Cu menggunakan surfaktan alkil poliglukosida /
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Format: | Thesis Book |
Language: | Malay |
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LEADER | 01331nam a2200349 i 4500 | ||
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003 | UKM | ||
005 | 20170711143700.0 | ||
008 | 170504s2010 my a m 000 0 may d | ||
039 | 9 | |a 201707111437 |b nikzal |c 201707111425 |d nikzal |y 05-04-2017 |z hamdan | |
040 | |a UKM |e rda | ||
090 | |a TS670.S438 2010 tesis | ||
090 | |a TS670 |b .S438 2010 | ||
100 | 0 | |a Setia Budi, |e author. | |
245 | 1 | 0 | |a Elektropengendapan aloi nanostruktur Co-Ni-Cu menggunakan surfaktan alkil poliglukosida / |c Setia Budi. |
264 | 0 | |c 2010. | |
300 | |a xiii, 87 pages : |b illustrations ; |c 30 cm. | ||
336 | |a text |2 rdacontent | ||
337 | |a unmediated |2 rdamedia | ||
338 | |a volume |2 rdacarrier | ||
502 | |a Tesis (Sarjana Sains)-Universiti Kebangsaan Malaysia, 2010. | ||
504 | |a Rujukan : mukasurat [77]-86. | ||
610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations. |
650 | 0 | |a Dissertations, Academic |z Malaysia. | |
650 | 0 | |a Surface active agents. | |
650 | 0 | |a Electroplating. | |
650 | 0 | |a Nanostructures. | |
907 | |a .b16471519 |b 28-09-20 |c 12-11-19 | ||
998 | |a t |b 05-04-17 |c m |d x |e - |f may |g my |h 0 | ||
914 | |a vtls003621746 | ||
990 | |a hak/nz | ||
991 | |a Fakulti Sains dan Teknologi | ||
945 | |a TS670.S438 2010 tesis (00008051636) |g 1 |i 00002205655 |j 0 |l t0040 |n No. of pieces: 1 |o - |p MYR0.00 |q - |r - |s - |t 3 |u 0 |v 0 |w 0 |x 0 |y .i21033730 |z 12-11-19 |