Tan, K. S. (2019). Thermomechanical study of lead-free solder joints and the effects of carbon-based additives.
Chicago Style (17th ed.) CitationTan, Khai Shiang. Thermomechanical Study of Lead-free Solder Joints and the Effects of Carbon-based Additives. 2019.
MLA引文Tan, Khai Shiang. Thermomechanical Study of Lead-free Solder Joints and the Effects of Carbon-based Additives. 2019.
警告:這些引文格式不一定是100%准確.