APA引文

Onn, S. J. (2019). Experimental and numerical studies of thermally induced warpage in printed circuit board.

Chicago Style (17th ed.) Citation

Onn, Sim Jui. Experimental and Numerical Studies of Thermally Induced Warpage in Printed Circuit Board. 2019.

MLA引文

Onn, Sim Jui. Experimental and Numerical Studies of Thermally Induced Warpage in Printed Circuit Board. 2019.

警告：這些引文格式不一定是100％准確.