Onn, S. J. (2019). Experimental and numerical studies of thermally induced warpage in printed circuit board.
Chicago Style (17th ed.) CitationOnn, Sim Jui. Experimental and Numerical Studies of Thermally Induced Warpage in Printed Circuit Board. 2019.
MLA引文Onn, Sim Jui. Experimental and Numerical Studies of Thermally Induced Warpage in Printed Circuit Board. 2019.
警告:這些引文格式不一定是100%准確.