Onn, S. J. (2019). Experimental and numerical studies of thermally induced warpage in printed circuit board.
Chicago Style (17th ed.) CitationOnn, Sim Jui. Experimental and Numerical Studies of Thermally Induced Warpage in Printed Circuit Board. 2019.
MLA (8th ed.) CitationOnn, Sim Jui. Experimental and Numerical Studies of Thermally Induced Warpage in Printed Circuit Board. 2019.
Warning: These citations may not always be 100% accurate.