Experimental and numerical studies of thermally induced warpage in printed circuit board
Microelectronics consist of extremely small elements which are micrometre scal or smaller. It includes the manufacturing of components like transistors, diodes, capacitors etc. Printed circuit board (PCB) owns the most significant development in circuit packaging. It is the most common structure th...
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my-mmu-ep.128522024-08-21T08:35:31Z Experimental and numerical studies of thermally induced warpage in printed circuit board 2019-11 Onn, Sim Jui TK7800-8360 Electronics Microelectronics consist of extremely small elements which are micrometre scal or smaller. It includes the manufacturing of components like transistors, diodes, capacitors etc. Printed circuit board (PCB) owns the most significant development in circuit packaging. It is the most common structure that provides interconnection and allow components to be assembled on it, hence its flatness is always the main concern in MST manufacturing. In order to ensure product reliability, the monitoring of thermally induced warpage of PCB during high temperature reflow is essential. PCB deformation occurs when there is a mismatch of coefficients of thermal expansion between the materials. The deformation that occur during reflow can affect board solder joint reliability such as delamination and crack between interconnects. In this work, the thermos-mechanical behaviour of PCB in microelectronic package is investigated by simulation and experiment. The effect of thermo-mechanical properties, temperature difference in reflow, Cu distribution and stack up of PCB, initial warpage of PCB, as well as the effect of fixtures towards the warpage of PCB will be studied. 2019-11 Thesis https://shdl.mmu.edu.my/12852/ http://erep.mmu.edu.my/ masters Multimedia University Faculty of Engineering (FOE) EREP ID: 12276 |
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Multimedia University |
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MMU Institutional Repository |
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TK7800-8360 Electronics |
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TK7800-8360 Electronics Onn, Sim Jui Experimental and numerical studies of thermally induced warpage in printed circuit board |
| description |
Microelectronics consist of extremely small elements which are micrometre scal or smaller. It includes the manufacturing of components like transistors, diodes, capacitors etc. Printed circuit board (PCB) owns the most significant development in circuit packaging. It is the most common structure that provides interconnection and allow components to be assembled on it, hence its flatness is always the main concern in MST manufacturing. In order to ensure product reliability, the monitoring of thermally induced warpage of PCB during high temperature reflow is essential. PCB deformation occurs when there is a mismatch of coefficients of thermal expansion between the materials. The deformation that occur during reflow can affect board solder joint reliability such as delamination and crack between interconnects. In this work, the thermos-mechanical behaviour of PCB in microelectronic package is investigated by simulation and experiment. The effect of thermo-mechanical properties, temperature difference in reflow, Cu distribution and stack up of PCB, initial warpage of PCB, as well as the effect of fixtures towards the warpage of PCB will be studied. |
| format |
Thesis |
| qualification_level |
Master's degree |
| author |
Onn, Sim Jui |
| author_facet |
Onn, Sim Jui |
| author_sort |
Onn, Sim Jui |
| title |
Experimental and numerical studies of thermally induced warpage in printed circuit board |
| title_short |
Experimental and numerical studies of thermally induced warpage in printed circuit board |
| title_full |
Experimental and numerical studies of thermally induced warpage in printed circuit board |
| title_fullStr |
Experimental and numerical studies of thermally induced warpage in printed circuit board |
| title_full_unstemmed |
Experimental and numerical studies of thermally induced warpage in printed circuit board |
| title_sort |
experimental and numerical studies of thermally induced warpage in printed circuit board |
| granting_institution |
Multimedia University |
| granting_department |
Faculty of Engineering (FOE) |
| publishDate |
2019 |
| _version_ |
1811768008749613056 |