Experimental and numerical studies of thermally induced warpage in printed circuit board

Microelectronics consist of extremely small elements which are micrometre scal or smaller. It includes the manufacturing of components like transistors, diodes, capacitors etc. Printed circuit board (PCB) owns the most significant development in circuit packaging. It is the most common structure th...

Full description

Saved in:
Bibliographic Details
Main Author: Onn, Sim Jui
Format: Thesis
Published: 2019
Subjects:
Tags: Add Tag
No Tags, Be the first to tag this record!