Experimental and numerical studies of thermally induced warpage in printed circuit board

Experimental and numerical studies of thermally induced warpage in printed circuit board

Microelectronics consist of extremely small elements which are micrometre scal or smaller. It includes the manufacturing of components like transistors, diodes, capacitors etc. Printed circuit board (PCB) owns the most significant development in circuit packaging. It is the most common structure th...

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書目詳細資料
主要作者:	Onn, Sim Jui
格式:	Thesis
出版:	2019
主題:	TK7800-8360 Electronics
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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