Experimental and numerical studies of thermally induced warpage in printed circuit board
Microelectronics consist of extremely small elements which are micrometre scal or smaller. It includes the manufacturing of components like transistors, diodes, capacitors etc. Printed circuit board (PCB) owns the most significant development in circuit packaging. It is the most common structure th...
محفوظ في:
المؤلف الرئيسي: | Onn, Sim Jui |
---|---|
التنسيق: | أطروحة |
منشور في: |
2019
|
الموضوعات: | |
الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
|
مواد مشابهة
-
Development Of Lab On Printed Circuit Board Based Heavy Metal Detection
بواسطة: Beh, Khi Khim
منشور في: (2023) -
Analysis And Design Of Coplanar Waveguide For High-Speed Pulse Propagation On Printed Circuit Board
بواسطة: Abdullah, Mohd Muhaiyiddin
منشور في: (2007) -
The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board
بواسطة: Mohammed Nwehil, Aghssan
منشور في: (2018) -
Micro scalar patterning for printing ultra fine solid lines in flexographic printing process
بواسطة: Hassan, Suhaimi
منشور في: (2018) -
Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging
بواسطة: Ong, Ling Li
منشور في: (2016)