Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding

Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding

In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation s...

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Main Author: Lee, Foo Yeong
Format: Thesis
Published: 2011
Subjects:
TK7800-8360 Electronics
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id my-mmu-ep.3470
record_format uketd_dc
spelling my-mmu-ep.34702012-04-09T04:14:41Z Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding 2011-03 Lee, Foo Yeong TK7800-8360 Electronics In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation software instead of commercial CAD application to generate the bonding path component of the wire bonding program. 2011-03 Thesis http://shdl.mmu.edu.my/3470/ http://vlib.mmu.edu.my/diglib/login/dlusr/login.php masters University of Multimedia Research Library
institution Multimedia University
collection MMU Institutional Repository
topic TK7800-8360 Electronics
spellingShingle TK7800-8360 Electronics
Lee, Foo Yeong
Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding
description In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation software instead of commercial CAD application to generate the bonding path component of the wire bonding program.
format Thesis
qualification_level Master's degree
author Lee, Foo Yeong
author_facet Lee, Foo Yeong
author_sort Lee, Foo Yeong
title Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding
title_short Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding
title_full Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding
title_fullStr Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding
title_full_unstemmed Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding
title_sort development, implementation and analysis of direct integration offline method in wire bonding
granting_institution University of Multimedia
granting_department Research Library
publishDate 2011
_version_ 1747829503603769344

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