Fabrication and characterization of platinum/barium strontium titanate/nickel-iron/copper capacitor for storage application
In this research work, a new capacitor stack platinum/barium strontium titanate/nickel-iron/copper (Pt/BST/Ni-Fe/Cu) has been designed and fabricated with platinum as top electrode, barium strontium titanate (Ba0.5Sr0.5TiO) as dielectric material and nickel-iron thin film deposited copper substrate...
محفوظ في:
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| منشور في: |
2012
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| الموضوعات: | |
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إضافة وسم
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| الملخص: | In this research work, a new capacitor stack platinum/barium strontium titanate/nickel-iron/copper (Pt/BST/Ni-Fe/Cu) has been designed and fabricated with platinum as top electrode, barium strontium titanate (Ba0.5Sr0.5TiO) as dielectric material and nickel-iron thin film deposited copper substrate (Ni-Fe/Cu) as bottom electrode. This capacitor is used for storage application like a dynamic random access memory cell. The as-fabricated capacitor offered dielectric constant of 690, dielectric loss of 0.05 at frequency of 1 kHz and leakage current density of 33 nA/cm2 for ± 5 V. |
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