Fabrication and characterization of platinum/barium strontium titanate/nickel-iron/copper capacitor for storage application
In this research work, a new capacitor stack platinum/barium strontium titanate/nickel-iron/copper (Pt/BST/Ni-Fe/Cu) has been designed and fabricated with platinum as top electrode, barium strontium titanate (Ba0.5Sr0.5TiO) as dielectric material and nickel-iron thin film deposited copper substrate...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Published: |
2012
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | In this research work, a new capacitor stack platinum/barium strontium titanate/nickel-iron/copper (Pt/BST/Ni-Fe/Cu) has been designed and fabricated with platinum as top electrode, barium strontium titanate (Ba0.5Sr0.5TiO) as dielectric material and nickel-iron thin film deposited copper substrate (Ni-Fe/Cu) as bottom electrode. This capacitor is used for storage application like a dynamic random access memory cell. The as-fabricated capacitor offered dielectric constant of 690, dielectric loss of 0.05 at frequency of 1 kHz and leakage current density of 33 nA/cm2 for ± 5 V. |
|---|