Fabrication and characterisation of magnetron sputtered copper thin films
Applications of copper (Cu) thin films have emerged from microelectronics to nanotechnology. The primary applications of Cu are as interconnects in microelectronics. With the rapid shrinking in the size of electronic devices, the Cu thin films play an essential role in conductors and optical data st...
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2011
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| Summary: | Applications of copper (Cu) thin films have emerged from microelectronics to nanotechnology. The primary applications of Cu are as interconnects in microelectronics. With the rapid shrinking in the size of electronic devices, the Cu thin films play an essential role in conductors and optical data storage and surface-plasmon enhanced light absorption for photovoltaic materials for numerous nanoelectronic and nano-optoelectronic applications. Substrate heating in sputtering deposition process is an important consideration in microelectronics industries in growing variety of thin films for insulators, conducting and semiconducting layers for making of microelectronic components and devices. The change in temperature during sputtering deposition process will affect the manufacturing cost and also microelectronics device performance. Therefore, this research work is dedicated to the investigation into the influence of deposition process parameters such as deposition duration, sputtering power and working gas pressure on substrate heating in the magnetron sputtering deposition process. The results show that the heating effect during the sputtering process increases with increase in deposition duration, sputtering power and working gas pressure. Further this research work also describes the material properties Cu thin films fabricated using magnetron sputtering on silicon (Si) and glass substrates with various deposition parameters. |
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