Influence of Alumina and Titanium Dioxide Nanoparticles Reinforcement on Sn-3.0ag-0.5cu and Sn-58bi Solder Alloys
This research investigates the influence of aluminium oxide (Al2O3) and titanium dioxide (TiO2) nanoparticles added to Sn-3.0Ag-0.5Cu and Sn-58Bi solders and compared to the bare Sn-3.0Ag-0.5Cu and Sn-58Bi solders which are novel studies in this field especially for the study of the Sn-58Bi added wi...
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| Format: | Thesis |
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2015
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| Summary: | This research investigates the influence of aluminium oxide (Al2O3) and titanium dioxide (TiO2) nanoparticles added to Sn-3.0Ag-0.5Cu and Sn-58Bi solders and compared to the bare Sn-3.0Ag-0.5Cu and Sn-58Bi solders which are novel studies in this field especially for the study of the Sn-58Bi added with nanoparticles. The lowest melting temperature was noted for the Sn-3.0Ag-0.5Cu added with 3% Al2O3 and TiO2 nanoparticles with 220.64°C and 220.30°C, while for Sn-58Bi reinforcement, the lowest temperature was for the 1% Al2O3 and TiO2 addition of 144.25°C and 142.80°C, yet both reinforced solder alloy had melting temperatures slightly 1°C higher than the bare solders. Microstructures of Sn-3.0Ag-0.5Cu reinforced solder alloy refined as additions were made with smaller Sinn-matrix and wider eutectic phase comprising Ag3Sn and Cu6Sn5 intermetallic compounds (IMC). As for the Sn-58Bi solder alloy, the microstructure consists of lamellar structure with Bi precipitations and eutectic phases. All the important physical, metallurgical and mechanical properties were studied to achieve the objectives. |
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