Loon, K. T. (2019). Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials.
Chicago Style (17th ed.) CitationLoon, Kuan Teng. Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials. 2019.
MLA (8th ed.) CitationLoon, Kuan Teng. Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials. 2019.
Warning: These citations may not always be 100% accurate.