Loon, K. T. (2019). Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials.
توثيق أسلوب شيكاغو (الطبعة السابعة عشر)Loon, Kuan Teng. Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials. 2019.
توثيق جمعية اللغة المعاصرة MLA (الطبعة الثامنة)Loon, Kuan Teng. Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials. 2019.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.