APA引文

Loon, K. T. (2019). Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials.

Chicago Style (17th ed.) Citation

Loon, Kuan Teng. Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials. 2019.

MLA引文

Loon, Kuan Teng. Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials. 2019.

警告：這些引文格式不一定是100％准確.