Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials
Simulating the effects of flexural bending on the reliability of components mounted on printed circuit boards (PCBs) is of practical importance in the electronics industry. This often necessitates an accurate model of the PCBs. PCBs are nonhomogeneous and anisotropic composites consisting of copper...
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| Format: | Thesis |
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2019
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| Summary: | Simulating the effects of flexural bending on the reliability of components mounted on printed circuit boards (PCBs) is of practical importance in the electronics industry. This often necessitates an accurate model of the PCBs. PCBs are nonhomogeneous and anisotropic composites consisting of copper traces, glass-reinforced epoxy laminate (FR4), solder mask, vias and other features. Their different lay-outs and lay-ups result in differences in mechanical properties. To obtain the elastic constants of PCBs experimentally is costly and timeconsuming. Thus, finite element analysis is an alternative way to predict the elastic behaviour of PCBs without extensive testing. Past efforts to model the elastic behaviour of PCBs involve either simplistic assumptions or complicated and detailed modelling. It will be useful if the mechanical behaviour of a PCB can be predicted based on geometrical features and material properties of the constituents alone. Such prediction will enable manufacturers of electronic devices to better simulate the reliability of their devices by predicting possible failures of mounted components. In this study, a practical method that gives reasonably accurate predictions of PCB’s elastic deformation is proposed. Two different industrial PCBs, namely GMOI and FCV, were used for this approach. Four micromechanics models for fibrous composite, namely the Cox-Krenchel, modified Cox lamina, Pan and Rule of Mixtures, were employed in computing the mechanical properties of an industrial printed circuit board. Copper trace orientations were accounted for in the modified Cox lamina model. |
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