Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials

Simulating the effects of flexural bending on the reliability of components mounted on printed circuit boards (PCBs) is of practical importance in the electronics industry. This often necessitates an accurate model of the PCBs. PCBs are nonhomogeneous and anisotropic composites consisting of copper...

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Main Author:	Loon, Kuan Teng
Format:	Thesis
Published:	2019
Subjects:	TK7885-7895 Computer engineering Computer hardware
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id	my-mmu-ep.7738
record_format	uketd_dc
spelling	my-mmu-ep.77382020-09-21T05:49:04Z Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials 2019-02 Loon, Kuan Teng TK7885-7895 Computer engineering. Computer hardware Simulating the effects of flexural bending on the reliability of components mounted on printed circuit boards (PCBs) is of practical importance in the electronics industry. This often necessitates an accurate model of the PCBs. PCBs are nonhomogeneous and anisotropic composites consisting of copper traces, glass-reinforced epoxy laminate (FR4), solder mask, vias and other features. Their different lay-outs and lay-ups result in differences in mechanical properties. To obtain the elastic constants of PCBs experimentally is costly and timeconsuming. Thus, finite element analysis is an alternative way to predict the elastic behaviour of PCBs without extensive testing. Past efforts to model the elastic behaviour of PCBs involve either simplistic assumptions or complicated and detailed modelling. It will be useful if the mechanical behaviour of a PCB can be predicted based on geometrical features and material properties of the constituents alone. Such prediction will enable manufacturers of electronic devices to better simulate the reliability of their devices by predicting possible failures of mounted components. In this study, a practical method that gives reasonably accurate predictions of PCB’s elastic deformation is proposed. Two different industrial PCBs, namely GMOI and FCV, were used for this approach. Four micromechanics models for fibrous composite, namely the Cox-Krenchel, modified Cox lamina, Pan and Rule of Mixtures, were employed in computing the mechanical properties of an industrial printed circuit board. Copper trace orientations were accounted for in the modified Cox lamina model. 2019-02 Thesis http://shdl.mmu.edu.my/7738/ http://library.mmu.edu.my/library2/diglib/mmuetd/ masters Multimedia University Faculty of Engineering & Technology
institution	Multimedia University
collection	MMU Institutional Repository
topic	TK7885-7895 Computer engineering Computer hardware
spellingShingle	TK7885-7895 Computer engineering Computer hardware Loon, Kuan Teng Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials
description	Simulating the effects of flexural bending on the reliability of components mounted on printed circuit boards (PCBs) is of practical importance in the electronics industry. This often necessitates an accurate model of the PCBs. PCBs are nonhomogeneous and anisotropic composites consisting of copper traces, glass-reinforced epoxy laminate (FR4), solder mask, vias and other features. Their different lay-outs and lay-ups result in differences in mechanical properties. To obtain the elastic constants of PCBs experimentally is costly and timeconsuming. Thus, finite element analysis is an alternative way to predict the elastic behaviour of PCBs without extensive testing. Past efforts to model the elastic behaviour of PCBs involve either simplistic assumptions or complicated and detailed modelling. It will be useful if the mechanical behaviour of a PCB can be predicted based on geometrical features and material properties of the constituents alone. Such prediction will enable manufacturers of electronic devices to better simulate the reliability of their devices by predicting possible failures of mounted components. In this study, a practical method that gives reasonably accurate predictions of PCB’s elastic deformation is proposed. Two different industrial PCBs, namely GMOI and FCV, were used for this approach. Four micromechanics models for fibrous composite, namely the Cox-Krenchel, modified Cox lamina, Pan and Rule of Mixtures, were employed in computing the mechanical properties of an industrial printed circuit board. Copper trace orientations were accounted for in the modified Cox lamina model.
format	Thesis
qualification_level	Master's degree
author	Loon, Kuan Teng
author_facet	Loon, Kuan Teng
author_sort	Loon, Kuan Teng
title	Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials
title_short	Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials
title_full	Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials
title_fullStr	Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials
title_full_unstemmed	Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials
title_sort	predicting the elastic behaviour of multilayer high density interconnect printed circuit board from its constituent materials
granting_institution	Multimedia University
granting_department	Faculty of Engineering & Technology
publishDate	2019
_version_	1747829670633537536

Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials

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