Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials
Simulating the effects of flexural bending on the reliability of components mounted on printed circuit boards (PCBs) is of practical importance in the electronics industry. This often necessitates an accurate model of the PCBs. PCBs are nonhomogeneous and anisotropic composites consisting of copper...
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Main Author: | Loon, Kuan Teng |
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Format: | Thesis |
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2019
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