Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials

Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials

Simulating the effects of flexural bending on the reliability of components mounted on printed circuit boards (PCBs) is of practical importance in the electronics industry. This often necessitates an accurate model of the PCBs. PCBs are nonhomogeneous and anisotropic composites consisting of copper...

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書目詳細資料
主要作者:	Loon, Kuan Teng
格式:	Thesis
出版:	2019
主題:	TK7885-7895 Computer engineering Computer hardware
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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