Lead Electromigration In Flip Chip Packaging Under Hast Environment
Failure under HAST condition will cause device malfunction. Lead migration can occur under HAST stress when two signals are biased. Lead migrates from solder bump to the adjacent copper trace in substrate causing electrical failure. The focus of this project is on the failure mechanism of the lead...
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2004
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my-mmu-ep.9412010-07-13T03:08:57Z Lead Electromigration In Flip Chip Packaging Under Hast Environment 2004-12 Wong, Shaw Hwang TK7800-8360 Electronics Failure under HAST condition will cause device malfunction. Lead migration can occur under HAST stress when two signals are biased. Lead migrates from solder bump to the adjacent copper trace in substrate causing electrical failure. The focus of this project is on the failure mechanism of the lead migration to understand how the lead migrates from bump. 2004-12 Thesis http://shdl.mmu.edu.my/941/ http://myto.perpun.net.my/metoalogin/logina.php masters Multimedia University Research Library |
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Multimedia University |
| collection |
MMU Institutional Repository |
| topic |
TK7800-8360 Electronics |
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TK7800-8360 Electronics Wong, Shaw Hwang Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| description |
Failure under HAST condition will cause device malfunction. Lead migration can occur under HAST stress when two signals are biased. Lead migrates from solder bump to the adjacent copper trace in substrate causing electrical failure.
The focus of this project is on the failure mechanism of the lead migration to understand how the lead migrates from bump. |
| format |
Thesis |
| qualification_level |
Master's degree |
| author |
Wong, Shaw Hwang |
| author_facet |
Wong, Shaw Hwang |
| author_sort |
Wong, Shaw Hwang |
| title |
Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_short |
Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_full |
Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_fullStr |
Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_full_unstemmed |
Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_sort |
lead electromigration in flip chip packaging under hast environment |
| granting_institution |
Multimedia University |
| granting_department |
Research Library |
| publishDate |
2004 |
| _version_ |
1747829268911489024 |