Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System

Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System

The effect of gold -aluminum intermetallic growth at elevated temperatures on bond shear strength is studied. A diffusion model is derived from the Fick's first law for verifying with the measurement of gold-aluminum diffusion reaction rate.

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Bibliographic Details
Main Author: Chan, Sook Chien
Format: Thesis
Published: 2002
Subjects:
TK7800-8360 Electronics
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spelling my-mmu-ep.9442010-07-13T03:06:56Z Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System 2002-09 Chan, Sook Chien TK7800-8360 Electronics The effect of gold -aluminum intermetallic growth at elevated temperatures on bond shear strength is studied. A diffusion model is derived from the Fick's first law for verifying with the measurement of gold-aluminum diffusion reaction rate. 2002-09 Thesis http://shdl.mmu.edu.my/944/ http://myto.perpun.net.my/metoalogin/logina.php masters Multimedia University Research Library
institution Multimedia University
collection MMU Institutional Repository
topic TK7800-8360 Electronics
spellingShingle TK7800-8360 Electronics
Chan, Sook Chien
Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System
description The effect of gold -aluminum intermetallic growth at elevated temperatures on bond shear strength is studied. A diffusion model is derived from the Fick's first law for verifying with the measurement of gold-aluminum diffusion reaction rate.
format Thesis
qualification_level Master's degree
author Chan, Sook Chien
author_facet Chan, Sook Chien
author_sort Chan, Sook Chien
title Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System
title_short Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System
title_full Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System
title_fullStr Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System
title_full_unstemmed Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System
title_sort effects of intermetallic growth and bonding parameters on wire- bond strength for gold - aluminium system
granting_institution Multimedia University
granting_department Research Library
publishDate 2002
_version_ 1747829269637103616

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