Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging
The flip chip-on-board technology of using Sn-Pb solder bump is becoming more common in the electronic packaging industry owing to cost saving in cladded printed circuit. But problem that plague the electronics packaging industry, like the non-wet solder joints, extrusion, etc, need to be studied. E...
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2002
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my-mmu-ep.9602010-07-14T02:30:14Z Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging 2002-09 Yong, Su Kiat TK7800-8360 Electronics The flip chip-on-board technology of using Sn-Pb solder bump is becoming more common in the electronic packaging industry owing to cost saving in cladded printed circuit. But problem that plague the electronics packaging industry, like the non-wet solder joints, extrusion, etc, need to be studied. Effects of environmental exposure of dies left in the tape and storage for prolonged period on the chemical stability and packaging have yet been studied. 2002-09 Thesis http://shdl.mmu.edu.my/960/ http://myto.perpun.net.my/metoalogin/logina.php masters Multimedia University Research Library |
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Multimedia University |
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MMU Institutional Repository |
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TK7800-8360 Electronics |
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TK7800-8360 Electronics Yong, Su Kiat Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging |
| description |
The flip chip-on-board technology of using Sn-Pb solder bump is becoming more common in the electronic packaging industry owing to cost saving in cladded printed circuit. But problem that plague the electronics packaging industry, like the non-wet solder joints, extrusion, etc, need to be studied. Effects of environmental exposure of dies left in the tape and storage for prolonged period on the chemical stability and packaging have yet been studied. |
| format |
Thesis |
| qualification_level |
Master's degree |
| author |
Yong, Su Kiat |
| author_facet |
Yong, Su Kiat |
| author_sort |
Yong, Su Kiat |
| title |
Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging |
| title_short |
Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging |
| title_full |
Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging |
| title_fullStr |
Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging |
| title_full_unstemmed |
Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging |
| title_sort |
oxidation of lead - tin solder bumps in c4 electronics packaging |
| granting_institution |
Multimedia University |
| granting_department |
Research Library |
| publishDate |
2002 |
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1747829273278808064 |