Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging
The flip chip-on-board technology of using Sn-Pb solder bump is becoming more common in the electronic packaging industry owing to cost saving in cladded printed circuit. But problem that plague the electronics packaging industry, like the non-wet solder joints, extrusion, etc, need to be studied. E...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Published: |
2002
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|