Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging
The flip chip-on-board technology of using Sn-Pb solder bump is becoming more common in the electronic packaging industry owing to cost saving in cladded printed circuit. But problem that plague the electronics packaging industry, like the non-wet solder joints, extrusion, etc, need to be studied. E...
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Main Author: | Yong, Su Kiat |
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Format: | Thesis |
Published: |
2002
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