Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints

The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in s...

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Bibliographic Details
Main Author:	Leong, Kum Foo
Format:	Thesis
Published:	2003
Subjects:	QA Mathematics
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id	my-mmu-ep.971
record_format	uketd_dc
spelling	my-mmu-ep.9712010-07-15T06:31:45Z Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints 2003-10 Leong, Kum Foo QA Mathematics The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in some of the peripherals. In this project, the effect of repeated wave-soldering heating on the SMT mounted Sn/Pb eutectic solder joint on HASL (Hot Air Solder Leveling) PCB is investigated by measuring its three point bend strength. 2003-10 Thesis http://shdl.mmu.edu.my/971/ http://myto.perpun.net.my/metoalogin/logina.php masters Multimedia University Research Library
institution	Multimedia University
collection	MMU Institutional Repository
topic	QA Mathematics
spellingShingle	QA Mathematics Leong, Kum Foo Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
description	The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in some of the peripherals. In this project, the effect of repeated wave-soldering heating on the SMT mounted Sn/Pb eutectic solder joint on HASL (Hot Air Solder Leveling) PCB is investigated by measuring its three point bend strength.
format	Thesis
qualification_level	Master's degree
author	Leong, Kum Foo
author_facet	Leong, Kum Foo
author_sort	Leong, Kum Foo
title	Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
title_short	Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
title_full	Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
title_fullStr	Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
title_full_unstemmed	Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
title_sort	ternary intermetallic formation and mechanical strength of wave soldered bga joints
granting_institution	Multimedia University
granting_department	Research Library
publishDate	2003
_version_	1747829275958968320

Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints

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