Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in s...
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Main Author: | Leong, Kum Foo |
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Format: | Thesis |
Published: |
2003
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