PZT MMIC via hole fabrication technique / Raudah Abu Bakar

This study is carried out in order to investigate the effects of via hole grounding in newly proposed high dielectric constant material, lead zirconate titanate (PZT) thin films for MMIC applications. To predict the performance of via hole in PZT thin films, 50 x 50 ^im2 square and cylindrical vias...

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Main Author:	Abu Bakar, Raudah
Format:	Thesis
Language:	English
Published:	2010
Subjects:	Mechanics applied to machinery Dynamics Machine design and drawing Machine construction (General)
Online Access:	https://ir.uitm.edu.my/id/eprint/39530/1/39530.pdf
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id	my-uitm-ir.39530
record_format	uketd_dc
spelling	my-uitm-ir.395302022-04-05T08:37:32Z PZT MMIC via hole fabrication technique / Raudah Abu Bakar 2010-02 Abu Bakar, Raudah Mechanics applied to machinery. Dynamics Machine design and drawing Machine construction (General) This study is carried out in order to investigate the effects of via hole grounding in newly proposed high dielectric constant material, lead zirconate titanate (PZT) thin films for MMIC applications. To predict the performance of via hole in PZT thin films, 50 x 50 ^im2 square and cylindrical vias of various diameters were simulated using CST Microwave Studio over 0.1 to 20 GHz frequency range. The via test structures were patterned using a combination of electron beam lithography and wet etching technique for on-wafer characterization and were metallized with sputtered gold. The on-wafer characterization was performed using a Wiltron 37269A vector network analyzer and Cascade Microtech probe station with Cascade Infinity probes. The values of the resistance and inductance extracted from the simulation and measurement data were compared. The measured results exhibit inductive behavior which is similar to those obtained from the simulation, indicating successful via realization using a new wet etching technique with 0.5HF : 5HC1 : 10NH4C1 : 5OH2O composition. However, the inductance (18.839 pH) and resistance (1.212 £1) are found to be higher than the simulated values. 2010-02 Thesis https://ir.uitm.edu.my/id/eprint/39530/ https://ir.uitm.edu.my/id/eprint/39530/1/39530.pdf text en public masters Universiti Teknologi MARA Faculty of Electrical Engineering Awang, Zaiki (Prof. Dr.)
institution	Universiti Teknologi MARA
collection	UiTM Institutional Repository
language	English
advisor	Awang, Zaiki (Prof. Dr.)
topic	Mechanics applied to machinery Dynamics Machine design and drawing Machine construction (General)
spellingShingle	Mechanics applied to machinery Dynamics Machine design and drawing Machine construction (General) Abu Bakar, Raudah PZT MMIC via hole fabrication technique / Raudah Abu Bakar
description	This study is carried out in order to investigate the effects of via hole grounding in newly proposed high dielectric constant material, lead zirconate titanate (PZT) thin films for MMIC applications. To predict the performance of via hole in PZT thin films, 50 x 50 ^im2 square and cylindrical vias of various diameters were simulated using CST Microwave Studio over 0.1 to 20 GHz frequency range. The via test structures were patterned using a combination of electron beam lithography and wet etching technique for on-wafer characterization and were metallized with sputtered gold. The on-wafer characterization was performed using a Wiltron 37269A vector network analyzer and Cascade Microtech probe station with Cascade Infinity probes. The values of the resistance and inductance extracted from the simulation and measurement data were compared. The measured results exhibit inductive behavior which is similar to those obtained from the simulation, indicating successful via realization using a new wet etching technique with 0.5HF : 5HC1 : 10NH4C1 : 5OH2O composition. However, the inductance (18.839 pH) and resistance (1.212 £1) are found to be higher than the simulated values.
format	Thesis
qualification_level	Master's degree
author	Abu Bakar, Raudah
author_facet	Abu Bakar, Raudah
author_sort	Abu Bakar, Raudah
title	PZT MMIC via hole fabrication technique / Raudah Abu Bakar
title_short	PZT MMIC via hole fabrication technique / Raudah Abu Bakar
title_full	PZT MMIC via hole fabrication technique / Raudah Abu Bakar
title_fullStr	PZT MMIC via hole fabrication technique / Raudah Abu Bakar
title_full_unstemmed	PZT MMIC via hole fabrication technique / Raudah Abu Bakar
title_sort	pzt mmic via hole fabrication technique / raudah abu bakar
granting_institution	Universiti Teknologi MARA
granting_department	Faculty of Electrical Engineering
publishDate	2010
url	https://ir.uitm.edu.my/id/eprint/39530/1/39530.pdf
_version_	1783734516509048832

PZT MMIC via hole fabrication technique / Raudah Abu Bakar

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