PZT MMIC via hole fabrication technique / Raudah Abu Bakar
This study is carried out in order to investigate the effects of via hole grounding in newly proposed high dielectric constant material, lead zirconate titanate (PZT) thin films for MMIC applications. To predict the performance of via hole in PZT thin films, 50 x 50 ^im2 square and cylindrical vias...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | https://ir.uitm.edu.my/id/eprint/39530/1/39530.pdf |
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