Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim

This paper describes a deflection of encapsulation material on Lab-on-Chip (LOC) Biomedical device. The packaging technologies as described in this paper represent important steps in developing a user-friendly, practically usable encapsulation LOC device from a bare biochip. This development aims at...

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Main Author:	Abu Kassim, Mohd Nor Fadli
Format:	Thesis
Language:	English
Published:	2009
Subjects:	TK Electrical engineering Electronics Nuclear engineering
Online Access:	https://ir.uitm.edu.my/id/eprint/98476/1/98476.pdf
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id	my-uitm-ir.98476
record_format	uketd_dc
spelling	my-uitm-ir.984762024-08-22T09:18:38Z Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim 2009 Abu Kassim, Mohd Nor Fadli TK Electrical engineering. Electronics. Nuclear engineering This paper describes a deflection of encapsulation material on Lab-on-Chip (LOC) Biomedical device. The packaging technologies as described in this paper represent important steps in developing a user-friendly, practically usable encapsulation LOC device from a bare biochip. This development aims at a prototype device that can be applied for the evaluation of the biochip's analytical properties and the implementation of suitable assays in the field of medical diagnostic testing. The study involve in determine the best material for outer encapsulation which is required to protect the sensitive element on LOC during high-pressure transfer molded packaging process. The encapsulation material has to have maximum top surface deflection of 100 um under 100 atm vertical loading. The modeling was simulated using CoventorWare ver.2008 software. The material selected for these encapsulation LOC were Polyphenylene Sulfide (PPS) high modulus carbon fiber 55% and Liquid Crystal Polymer (LCP) carbon fiber. From the result it conclude that the PPS high modulus carbon fiber 55% is suitable for encapsulates LOC compared to LCP carbon fiber due to its strength, capable to endure deflection less than 100 um under uniform pressure applied on the top of encapsulation. 2009 Thesis https://ir.uitm.edu.my/id/eprint/98476/ https://ir.uitm.edu.my/id/eprint/98476/1/98476.pdf text en public degree Universiti Teknologi MARA (UiTM) Faculty of Electrical Engineering Husaini, Yusnira
institution	Universiti Teknologi MARA
collection	UiTM Institutional Repository
language	English
advisor	Husaini, Yusnira
topic	TK Electrical engineering Electronics Nuclear engineering
spellingShingle	TK Electrical engineering Electronics Nuclear engineering Abu Kassim, Mohd Nor Fadli Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
description	This paper describes a deflection of encapsulation material on Lab-on-Chip (LOC) Biomedical device. The packaging technologies as described in this paper represent important steps in developing a user-friendly, practically usable encapsulation LOC device from a bare biochip. This development aims at a prototype device that can be applied for the evaluation of the biochip's analytical properties and the implementation of suitable assays in the field of medical diagnostic testing. The study involve in determine the best material for outer encapsulation which is required to protect the sensitive element on LOC during high-pressure transfer molded packaging process. The encapsulation material has to have maximum top surface deflection of 100 um under 100 atm vertical loading. The modeling was simulated using CoventorWare ver.2008 software. The material selected for these encapsulation LOC were Polyphenylene Sulfide (PPS) high modulus carbon fiber 55% and Liquid Crystal Polymer (LCP) carbon fiber. From the result it conclude that the PPS high modulus carbon fiber 55% is suitable for encapsulates LOC compared to LCP carbon fiber due to its strength, capable to endure deflection less than 100 um under uniform pressure applied on the top of encapsulation.
format	Thesis
qualification_level	Bachelor degree
author	Abu Kassim, Mohd Nor Fadli
author_facet	Abu Kassim, Mohd Nor Fadli
author_sort	Abu Kassim, Mohd Nor Fadli
title	Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_short	Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_full	Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_fullStr	Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_full_unstemmed	Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_sort	carbon fiber encapsulation for packaging biomedical lab on chip components / mohd nor fadli abu kassim
granting_institution	Universiti Teknologi MARA (UiTM)
granting_department	Faculty of Electrical Engineering
publishDate	2009
url	https://ir.uitm.edu.my/id/eprint/98476/1/98476.pdf
_version_	1811768924151218176

Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim

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