Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint
Flip chip assembly, which is well known as controlled collapse chip connection (C4) has been widely used in semiconductor industry. Solder acts as a joining material in flip chip to interconnect chip with substrate, in order to provide electrical and mechanical continuity in assemblies. Since select...
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| 格式: | Thesis |
| 语言: | English |
| 出版: |
2017
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| 主题: | |
| 在线阅读: | http://umpir.ump.edu.my/id/eprint/19733/19/Effect%20of%20nickel%20doping%20into%20solder%20alloy%20and%20its%20strength%20between%20SnCu-Niimmersion%20gold%20joint.pdf |
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