Effect of electroless nickel-boron (EN-B) surface finish on solderability of SAC305 and solder joint strength
Rapid developments in technology have been a great challenge for the electronics industry to keep up with the industrial requirement to provide cost-effective smart devices while, at the same time, maintaining their quality. The quality of electronic packaging is directly related to the solder joint...
Saved in:
Main Author: | Hardinnawirda, Kahar |
---|---|
Format: | Thesis |
Language: | English |
Published: |
2017
|
Subjects: | |
Online Access: | http://umpir.ump.edu.my/id/eprint/19758/19/Effect%20of%20electroless%20nickel-boron%20%28EN-B%29%20surface%20finish%20on%20solderability%20of%20SAC305%20and%20solder%20joint%20strength.pdf |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
by: Mohamed Anuar, Rabiatul Adawiyah
Published: (2017) -
Effect of Zn additions on the electrochemical migration behaviour of SAC305 solder alloys /
by: Loh, Hwei Ling
Published: (2019) -
Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
by: Boo, Nan Shing
Published: (2010) -
Disperse Phase Method Particle Study With Doped Nano-Particles In Sac305 Solder
by: Said, Siti Haslinda Mohamed
Published: (2018) -
Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
by: Idris, Siti Rabiatull Aisha
Published: (2008)