Effect of electroless nickel-boron (EN-B) surface finish on solderability of SAC305 and solder joint strength
Rapid developments in technology have been a great challenge for the electronics industry to keep up with the industrial requirement to provide cost-effective smart devices while, at the same time, maintaining their quality. The quality of electronic packaging is directly related to the solder joint...
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | English |
| منشور في: |
2017
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://umpir.ump.edu.my/id/eprint/19758/19/Effect%20of%20electroless%20nickel-boron%20%28EN-B%29%20surface%20finish%20on%20solderability%20of%20SAC305%20and%20solder%20joint%20strength.pdf |
| الوسوم: |
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