The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
Epoxy foam was fabricated using sodium bicarbonate as the blowing agent. The epoxy foams were prepared using mechanical mixing method. Epoxy used in this study was product of bisphenol A and epichlorohydrin and the curing agent used was polyamide. In this study, the experiment part was consist of fo...
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| 格式: | Thesis |
| 語言: | English |
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| 在線閱讀: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33278/1/P.1-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33278/2/Full%20text.pdf |
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| 總結: | Epoxy foam was fabricated using sodium bicarbonate as the blowing agent. The epoxy foams were prepared using mechanical mixing method. Epoxy used in this study was product of bisphenol A and epichlorohydrin and the curing agent used was polyamide. In this study, the experiment part was consist of four parts with four different processing conditions which were at room temperature, at 80°C, with presence of catalyst (acetic acid) and with presence of reactive diluent (butyl glycidyl ether). Viscosity, density,
mechanical, dielectric and thermal properties were done for all the processing conditions. Blowing agent content was varied at 5, 10, 15, and 20 phr, respectively. For all processing conditions, 20 phr revealed the lowest value for viscosity, density, mechanical properties and dielectric properties. Among four parameters,
the most desired result was observed in sample processed with acetic acid and with presence of diluent because it exhibited lower dielectric constant which prefer for electronic packaging application. However, flexural strength and modulus of these epoxy foams were reduced. |
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