Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders

Lead based solder have been widely used before science have proven lead as one of the hazardous substances which can harm the environment and human health. With the banning usage of lead based solder as interconnect, various lead-free solders have been introduced and some of them are currently be...

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Main Author:	Muhammad Hafiz, Zan @ Hazizi
Format:	Thesis
Language:	English
Subjects:	Solders Solder and solderingSolder and soldering Lead-Free Solder Powder metallurgy Composite solder
Online Access:	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44220/1/p.1-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44220/2/full%20text.pdf
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id	my-unimap-44220
record_format	uketd_dc
spelling	my-unimap-442202016-11-30T03:39:52Z Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders Muhammad Hafiz, Zan @ Hazizi Mohd. Arif Anuar Mohd. Salleh Lead based solder have been widely used before science have proven lead as one of the hazardous substances which can harm the environment and human health. With the banning usage of lead based solder as interconnect, various lead-free solders have been introduced and some of them are currently being widely used. However, none of them still can surpass the properties of a lead based solder, which keeps the researches on lead-free solder still going on and on. In this project, a new lead-free composite solder was developed by adding various amount of Si3N4 into Sn-0.7Cu solder via powder metallurgy route which consists of mixing compaction and sintering. Composite solder was used in order to enhance the properties of the conventional solder. The project was divided into two phases, where at Phase 1, the optimization of mixing, compaction and sintering were studied while at Phase 2, the composite solder were tested, analyzed and compared with the monolithic solder. Upon completion of both phases, the best amount of Si3N4 was added into Sn-0.7Cu will be proposed. Generally, the Sn-0.7Cu-Si3N4 composite solder showed improvement compared to the monolithic solder and it was finally decided that Sn-0.7Cu-0.5Si3N4 was the most preferable composite solder. Universiti Malaysia Perlis (UniMAP) 2013 Thesis en http://dspace.unimap.edu.my:80/xmlui/handle/123456789/44220 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44220/1/p.1-24.pdf 96c0fc5774e5b04841e65db7f58342ee http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44220/2/full%20text.pdf 6ad51307c1085fba62fad5f396d35e7f http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44220/3/license.txt 8a4605be74aa9ea9d79846c1fba20a33 Solders Solder and solderingSolder and soldering Lead-Free Solder Powder metallurgy Composite solder School of Materials Engineering
institution	Universiti Malaysia Perlis
collection	UniMAP Institutional Repository
language	English
advisor	Mohd. Arif Anuar Mohd. Salleh
topic	Solders Solder and solderingSolder and soldering Lead-Free Solder Powder metallurgy Composite solder
spellingShingle	Solders Solder and solderingSolder and soldering Lead-Free Solder Powder metallurgy Composite solder Muhammad Hafiz, Zan @ Hazizi Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
description	Lead based solder have been widely used before science have proven lead as one of the hazardous substances which can harm the environment and human health. With the banning usage of lead based solder as interconnect, various lead-free solders have been introduced and some of them are currently being widely used. However, none of them still can surpass the properties of a lead based solder, which keeps the researches on lead-free solder still going on and on. In this project, a new lead-free composite solder was developed by adding various amount of Si3N4 into Sn-0.7Cu solder via powder metallurgy route which consists of mixing compaction and sintering. Composite solder was used in order to enhance the properties of the conventional solder. The project was divided into two phases, where at Phase 1, the optimization of mixing, compaction and sintering were studied while at Phase 2, the composite solder were tested, analyzed and compared with the monolithic solder. Upon completion of both phases, the best amount of Si3N4 was added into Sn-0.7Cu will be proposed. Generally, the Sn-0.7Cu-Si3N4 composite solder showed improvement compared to the monolithic solder and it was finally decided that Sn-0.7Cu-0.5Si3N4 was the most preferable composite solder.
format	Thesis
author	Muhammad Hafiz, Zan @ Hazizi
author_facet	Muhammad Hafiz, Zan @ Hazizi
author_sort	Muhammad Hafiz, Zan @ Hazizi
title	Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
title_short	Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
title_full	Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
title_fullStr	Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
title_full_unstemmed	Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
title_sort	development of lead-free sn-0.7cu-si3n4 composite solders
granting_institution	Universiti Malaysia Perlis (UniMAP)
granting_department	School of Materials Engineering
url	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44220/1/p.1-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44220/2/full%20text.pdf
_version_	1747836830434197504

Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders

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