APA引文

Najib Saedi, I. Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate.

Chicago Style (17th ed.) Citation

Najib Saedi, Ibrahim. Effect of Isothermal Aging to the Intermetallic Compound (IMC) Growth of Sn-0.7Cu-1.0Si₃N₄ Composite Solder on Copper Substrate.

MLA引文

Najib Saedi, Ibrahim. Effect of Isothermal Aging to the Intermetallic Compound (IMC) Growth of Sn-0.7Cu-1.0Si₃N₄ Composite Solder on Copper Substrate.