APA (7th ed.) Citation

Gan, C. L. Wearout reliability studies of bonding wires used in nano electronic device packaging.

Chicago Style (17th ed.) Citation

Gan, Chong Leong. Wearout Reliability Studies of Bonding Wires Used in Nano Electronic Device Packaging.

MLA (8th ed.) Citation

Gan, Chong Leong. Wearout Reliability Studies of Bonding Wires Used in Nano Electronic Device Packaging.

Warning: These citations may not always be 100% accurate.