APA引文

Gan, C. L. Wearout reliability studies of bonding wires used in nano electronic device packaging.

Chicago Style (17th ed.) Citation

Gan, Chong Leong. Wearout Reliability Studies of Bonding Wires Used in Nano Electronic Device Packaging.

MLA引文

Gan, Chong Leong. Wearout Reliability Studies of Bonding Wires Used in Nano Electronic Device Packaging.

警告：這些引文格式不一定是100％准確.