Wearout reliability studies of bonding wires used in nano electronic device packaging
Conventional bare Cu bonding wires, in general, are more susceptible to moisture corrosion compared to gold (Au) and Cu wires. There is very limited knowledge based reliability studies which have been carried out on 1st level interconnect (ball bond in this matter) on nano device semiconductor pa...
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| Format: | Thesis |
| Language: | English |
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| Online Access: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/59428/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/59428/2/Full%20text.pdf |
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