Wearout reliability studies of bonding wires used in nano electronic device packaging
Conventional bare Cu bonding wires, in general, are more susceptible to moisture corrosion compared to gold (Au) and Cu wires. There is very limited knowledge based reliability studies which have been carried out on 1st level interconnect (ball bond in this matter) on nano device semiconductor pa...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 語言: | English |
| 主題: | |
| 在線閱讀: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/59428/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/59428/2/Full%20text.pdf |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|