Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
One of the leading choices in upgrading the properties of existing lead-free solder alloys is by composite technology approach, whereby high technical ceramic particles can be added into the solder alloy matrix. Accordingly, Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder was synthesized using powder meta...
محفوظ في:
المؤلف الرئيسي: | Flora, Somidin |
---|---|
التنسيق: | أطروحة |
اللغة: | English |
الموضوعات: | |
الوصول للمادة أونلاين: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/61873/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/61873/2/Full%20text.pdf |
الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
|
مواد مشابهة
- Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
-
Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
بواسطة: Muhammad Hafiz, Zan @ Hazizi -
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag-0.5Cu solder alloys bearing Fe and Bi /
بواسطة: Mahdavifard, Mohammad Hossein
منشور في: (2017) -
Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7Cu lead-free solder alloy /
بواسطة: Jaffery, Syed Hassan Abbas
منشور في: (2017) -
Characterization of Sn-3.0Ag-0.5Cu/Cu solder joints by microwave hybrid heating with silicon wafer susceptor /
بواسطة: Mardiana Said
منشور في: (2022)