High power led thermal dissipation analysis via slug and heat sink
High power light emitting diode (LED), are captivating attention in recent times due to its cogent impacts on lighting industry in terms of efficacy, low power consumption, long lifetime and miniature physical size. However, the high junction temperature of the high power light emitting diodes co...
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| Format: | Thesis |
| Language: | English |
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| Online Access: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/63442/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/63442/2/Full%20text.pdf |
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| Summary: | High power light emitting diode (LED), are captivating attention in recent times due to
its cogent impacts on lighting industry in terms of efficacy, low power consumption,
long lifetime and miniature physical size. However, the high junction temperature of
the high power light emitting diodes continues to be a key issue in the LED industry as
it significantly influences the reliability and efficiency of the LED. In this research, the
thermal dissipation of a single chip high power light emitting diode package were
evaluated and analyzed through simulation. The prime focus of this research is placed
on the heat slug of the LED package and its effect on the LED chip in terms of junction
temperature, Von Mises stress and thermal resistances. The variation of the heat slug
was done in terms of size, slug material and shape. In addition, the effect of heat sink
design in terms of fin numbers and its influence on the junction temperature of the LED
was also investigated. The research was carried out using Ansys version 11. For the
first part of the research, the heat slug variation analysis was done. The single chip
LED package was powered with input power ranging from 0.1 W to 1 W. Two types of
heat slug shape; rectangular and cylindrical with varied dimension were used . Three
types of heat slug material, aluminum, copper and copper diamond was used and the
heat dissipation was compared. The simulation was carried out under four types of
conduction condition; natural convection condition, h = 5 W /m2C and three forced
convection condition,h = 10 W/m2C, 15 W/m2C and 20 W/m2C respectively. In the
second part of this research, heat sink fin number variation analysis was done. The
single chip LED package was varied by different heat sink design in terms of fin
numbers ranging from four fins to 20 fins. The key findings of heat slug variation
analysis in terms of heat slug shape, size and material at input power of 1 W showed
that the LED package with 1 = 5 rnm, w = 5 nun, h = 1 mm rectangular copper diamond
composite heat slug, under forced convection condition of h = 20 W/m2C exhibited the
best thermal performance with junction temperature of 56.01 °C with significant
reduction of 53.10 % in terms of junction temperature. In addition, the heat sink fin
number analysis showed that the LED package with 1 = 5 mm, w = 5 mm, h = 1 mm
rectangular copper diamond composite heat slug, under forced convection condition,
h = 20 W/m2C with 20 fm heat sink exhibited the best thermal performance with
junction temperature of 44.84 °C with significant reduction of 19.94 % in terms of
junction temperature. |
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